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Two-component epoxy resin AB adhesive.s

Two-component epoxy AB adhesive: resin (Part A) and hardener (Part B). Mix in ratio before dispensing, cure at room temp or with heat. Cured hard, high bond strength, good insulation, temperature and chemical resistance. Adheres to metals, ceramics, glass, stone, and most plastics. Used for structural bonding, potting, filling, repair, and assembly in electronics, hardware, crafts, etc. Suitable for diverse bonding/sealing applications.

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Product Details

Product Name	Two-component epoxy resin AB adhesive.s
Product Model	3:1–5:1 mixed adhesive and potting compound Color variations, identical functionality (black, gray, white)
Product Features	Suitable for securing magnetic rings and electronic components without requiring baking; this self-curing hard adhesive offers advantages such as impact resistance, vibration resistance, fine particle size, and strong adhesion.
Curing conditions	A: B = 4:1 (3:1 or 5:1) is acceptable. Standard type: 8-12 hours, slow-drying type: 12-16 hours or undergo low-temperature heating curing at 70°C for 40-60 minutes.
Characteristics after product curing	Hardness Shore D: 85 ±5; Thermal deformation temperature: 100-130° Insulation resistance: 1.0 × 1015 Flammability rating: UL94V-0.
Note	The adhesion site must be dry and clean. Stir thoroughly when mixing. After applying the adhesive, bake it first and then soak it in Vinyl Water.
Storage and Packaging	Store at room temperature for 180 days. A solution: 5 kg/barrel or 20 kg/barrel. B solution: 1 kg/barrel or 5 kg/barrel.

Two-component epoxy resin AB adhesive.s

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