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Single-component epoxy resin column soft glue

Single-component epoxy resin column soft glue is a pre-mixed epoxy adhesive with latent hardener and additives. No mixing, direct dispensing, heat-curing. Cured rigid with strong bond strength, insulation, and environmental resistance. Adheres well to metals, ceramics, and some engineering plastics. Used for electronic component bonding, chip encapsulation, sensor sealing, automotive electronics, optoelectronics, and industrial structural bonding/potting. Suitable for automated processes, meeting bonding, sealing, and reinforcement needs in various manufacturing.

  • Product Details
Product NameSingle-component epoxy resin column soft glue
Product Model

HC600 HB-HF  HC600 HG-HF  HC600 HD-HF

Color variations, identical functionality (black, gray, white)

Product FeaturesUsed for securing the side limbs of transformer cores and magnetic ring bases; this adhesive offers advantages such as impact resistance, vibration resistance, and high hardness.
Curing conditions110°-120°/1.5-2H (Actual baking time may vary depending on the specific circumstances).
Characteristics after product curing

Hardness Shore D: 90 ± 10;

Thermal expansion coefficient: ≤ 6.7×10⁻⁵/℃

Adhesion strength: ≥ 23 kg/cm²

Flammability rating: UL94V-0.

Note

The adhesion site must be dry and clean.

Due to the low weather and temperature, it is necessary to warm it up for 4-6 hours, or heat it to 50-60°C for 30-60 minutes before proceeding with the operation.

After applying the adhesive, bake it first and then soak it in Vinyl Water.

Storage and Packaging

Store at room temperature for 30 days, refrigerate below 5°C for 90 days.

1 kg/packaged in 5 kg/barrels/4 barrels per carton, totaling 20 kg.


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